Consider the cooling arrangement for the very large-scale integration (VLSI) chip of Problem 4.75. Use the finite-element

Question:

Consider the cooling arrangement for the very large-scale integration (VLSI) chip of Problem 4.75. Use the finite-element method of FEHT to obtain the following results.

(a) Determine the temperature distribution in the chip-substrate system. Will the maximum temperature exceed 85°C?

(b) Using the FEHT model developed for part (a), determine the volumetric heating rate that yields a maximum temperature of 85°C.

(c) What effect would reducing the substrate thickness have on the maximum operating temperature? For a volumetric generation rate of q = 10⁷ W/m³ reduce the thickness of the substrate from 12 mm to 6 mm, keeping all other dimensions unchanged. What is the maximum system temperature for these conditions? What fraction of the chip power generation is removed by convection directly from the chip surface?

Distribution
The word "distribution" has several meanings in the financial world, most of them pertaining to the payment of assets from a fund, account, or individual security to an investor or beneficiary. Retirement account distributions are among the most...

Fantastic news! We've Found the answer you've been seeking!

Step by Step Answer:

Answer rating: 83% (12 reviews)

KNOWN Silicon chip mounted in a dielectric substrate One surface of system is convectively cooled while the remaining surfaces are well insulated See Problem 475 Use the finiteelement software FEHT as ...View the full answer

Answered By

Lamya S

Highly creative, resourceful and dedicated High School Teacher with a good fluency in English (IELTS- 7.5 band scorer) and an excellent record of successful classroom presentations. I have more than 2 years experience in tutoring students especially by using my note making strategies. Especially adept at teaching methods of business functions and management through a positive, and flexible teaching style with the willingness to work beyond the call of duty. Committed to ongoing professional development and spreading the knowledge within myself to the blooming ones to make them fly with a colorful wing of future. I do always believe that more than being a teacher who teaches students subjects,...i rather want to be a teacher who wants to teach students how to love learning.. Subjects i handle : Business studies Management studies Operations Management Organisational Behaviour Change Management Research Methodology Strategy Management Economics Human Resource Management Performance Management Training International Business Business Ethics Business Communication Things you can expect from me : - A clear cut answer - A detailed conceptual way of explanation - Simplified answer form of complex topics - Diagrams and examples filled answers

4.90+ 46+ Reviews 54+ Question Solved

Related Book For book-img-for-question

Fundamentals of Heat and Mass Transfer

ISBN: 978-0471457282

6th Edition

Authors: Incropera, Dewitt, Bergman, Lavine

See More Books

Question Posted: Sep 24, 2010 05:21 AM

See More Questions

Consider the cooling arrangement for the very large-scale integration (VLSI) chip of Problem 4.75. Use the finite-element

Question:

Step by Step Answer:

KNOWN Silicon chip mounted in a dielectric substrate One surface of system is convectively cooled while the remaining surfaces are well insulated See Problem 475 Use the finiteelement software FEHT as ...View the full answer

Fundamentals of Heat and Mass Transfer

Students also viewed these Mechanical Engineering questions