An article in the IEEE Transactions on Semiconductor Manufacturing (Vol. 5, No. 3, 1992, pp. 214–222) describes an experiment to investigate the surface charge on a silicon wafer.

The factors thought to influence induced surface charge are cleaning method (spin rinse dry, or SRD, and spin dry, or SD)

and the position on the wafer where the charge was measured.

The surface charge (1011 q/cm3) response data are as shown.

(a) Compute the estimates of the effects and their standard errors for this design.

(b) Construct two-factor interaction plots and comment on the interaction of the factors.

(c) Use the t ratio to determine the significance of each effect with 0.05. Comment on your findings.

(d) Compute an approximate 95% CI for each effect.
Compare your results with those in part

(c) and comment.

(e) Perform an analysis of variance of the appropriate regression model for this design. Include in your analysis hypothesis tests for each coefficient, as well as residual analysis. State your final conclusions about the adequacy of the model. Compare your results to part

(c) and comment.

Transcribed Image Text:

Test Position L R 1.66 1.84 SD 1.90 1.84 Cleaning 1.92 1.62 Method -4.21 -7.58 SRD -1.35 -2.20 -2.08 -5.36