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1. An engineer at a semiconductor assembly plant is investigating the relationship between pull strength of a wire bond (psi) and the wire length (mm).
1. An engineer at a semiconductor assembly plant is investigating the relationship between pull strength of a wire bond (psi) and the wire length (mm). The data follow. (12 points) Pull Strength (y) |2 11 10 8 Wire Length (x) 10 17 32 35 25 a.) Fit a simple linear regression model relating pull strength to wire length using least squares. b.) What is the pull strength when the wire length is 30 mm? c.) What is the pull strength when the wire length is 50 mm? d.) What change in the pull strength is expected when the wire length changes by 6 mm?2. The probability of the Honda successfully completing the test is 0.80. Eight randomly chosen can are tested. What is the probability that at least 2 of the 8 cars successfully complete the test? (15 points) 3. Laser A and Laser B are used in a product and they are assumed to work independently. The probability that Laser A works is 0.8 and the probability that Laser B works is 0.9. (10 points) a. Draw a tree diagram and label all probabilities. b. Calculate the probability that exactly one laser fails. c. Calculate the probability that both lasers work
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