1. An integrated circuit commonly uses aluminum as an interconnect material. To prevent electromigration failure, 1.5wt%Cu is often added. Assume virtually all of Cu precipitates out as Cu2Al particles. a) What is "Electromigration failure"? Elaborate on "Electromigration" b) Calculate the atomic % of Cu in the alloy c) Calculate the volume % of Cu2Al in the alloy d) Assume that each Cu2Al particle was 0.2 um in diameter. How many particles would there be per unit volume, particles/cm 3 ? e) Calculate the average distance between any two Cu2Al particles