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2. An article in Electronic Components and Technology Conference (Vol 52, 2001, pp. 1167-1171) describes a study comparing single versus spindle saw processes for copper
2. An article in Electronic Components and Technology Conference (Vol 52, 2001, pp. 1167-1171) describes a study comparing single versus spindle saw processes for copper metallized wafers. A total of 15 devices of each type were measured for the width of the backside chips: single = 66.385, Ssingle = 7.895, and "double = 45.278, Sdouble = 8.612. (a) Do these data support the claim that both processes have the same chip outputs on average? Assume that both populations are normally distribution and have the same variance. Give the observed value of the test statistic, the p-value, and the conclusion. (b) Give a 95% confidence interval on the mean difference in spindle saw processes
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