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Profile of photo resist is one of the key parameters of photolithography process, can you describe a few process conditions (or techniques) that would
Profile of photo resist is one of the key parameters of photolithography process, can you describe a few process conditions (or techniques) that would leads to an undercut in the photo resist sidewall. (i.e. the photo resist has an inverted slope after the process)? (5 Pts) PR undercut Silicon Substrate.
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Answer Elching w Dry Etching for isobopc Etching dhe dy Removal of material Noisotropt 1 dll 0 wet c...
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Managerial accounting
Authors: ramji balakrishnan, k. s i varamakrishnan, Geoffrey b. sprin
1st edition
471467855, 978-0471467854
