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4 . A finned heat sink is used to cool an electronic component. The heat sink has a base area of 0 . 0 2

4. A finned heat sink is used to cool an electronic component. The heat sink has a base area of 0.02 m^2, and its thermal conductivity is 200 W/mK. The base temperature of the heat sink is maintained at 80\deg C, while the ambient temperature is 20\deg C. The fin thickness is 2 mm, and the fin height is 10 mm. The fin is made of aluminum with a thermal conductivity of 220 W/mK. Calculate the heat transfer rate from the heat sink, and the fin efficiency.

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