40 In FRACAS failure trend analysis, match these findings with their probable root cause (some may be used more than once, and some may not be used): - Different components from the same vendor fail in different applications. - Same component, possibly from different vendors, fails, but in the same location (on a circuit card, for example). - A component seems to fail, but when the component is removed and tested, it tests OK. - Failure only happens during certain conditions (such as environmental). A. Manufacturing workmanship or process issue. B. Design issue. C. Vendor process or vendor quality issue. D. Wearout issue