A PCB assembly line consists of $3$ operations: Screen

the boards, Place the components and solder the components in an oven. Each operation is described as follows $($Assume that Total Process Average $=$ Total Operation Nominal with a $2-$sided distribution.

$2/3.$

Screen: Quality measured by the height of the material deposited, through a control chart

Nominal $\_\_10$

$\_$

mils$\_\_$USL$\_12\_\_\_\_$No lower limit provided

Control Chart : Xdouble bar $\_\_10\mathrm{.}1\_\_\_\_\_$ UCLX $\_\_\_$

$11\mathrm{.}1\_\_\_\_\_$ LCLX $\_\_$

$9\mathrm{.}1\_\_\_$Sample Size $\_\_4\_\_$

Reject Rate $\_\_\_\_\_\_\_\_\_\_\_\_\%,\_\_\_\_\_\_\_\_\_$PPM$,$ Yield $\_\_\_\_\_\_\_\_\_\_\_\_\_\%$ Cp $\_\_\_\_\_\_\_\_,$ Cpk$\_\_\_\_\_\_\_\_\_\_\_$

Place: Quality measured by the defect rate obtained, using P chart with sample average $=100,$ assume process

centered and two$-$sided specification limit

Reject rate $\_\_1$ in $2,000,\%,$ PPM$,$ Yield $\_\_\_\_\_\_\_\_\_\_\_\_\_\%,$

Cp $\_\_\_\_\_\_\_\_,$ Cpk$\_\_\_\_\_\_\_\_\_\_\_$

Oven Quality measured by # solder shorts in $10,000$ parts, using C chart, assume process centered and two$-$

sided specification limit

Nominal $\_\_\_8$ short$/10,000$ parts, C chart : Cbar$\_\_\_\_\_\_\_,$ UCLc $\_\_\_\_\_\_\_$ LCLc $\_\_\_\_\_\_\_\_\_$

Reject Rate $\_\_\_\_\_\_\_\_\_\_\_\_\%,\_\_\_\_\_\_\_\_\_$PPM$,$ Yield $\_\_\_\_\_\_\_\_\_\_\_\_\_\%,$ Cp $\_\_\_\_\_\_\_\_,$ Cpk$\_\_\_\_\_\_\_\_\_\_\_$

Total Process: Quality measured by all defects in the line of three machines, assume process centered and two

sided specification limit

Reject Rate $\_\_\_\_\_\_\_\_\_\_\_\_\%,\_\_\_\_\_\_\_\_\_$PPM$,$ Yield $\_\_\_\_\_\_\_\_\_\_\_\_\_\%$ Cp $\_\_\_\_\_\_\_\_,$ Cpk$\_\_\_\_\_\_\_\_\_\_\_$