A square silicon chip of width W = 24.2 mm on a side is soldered to an aluminium heat sink (k = 205 W/m.K) of the same width as shown in Fig. Q2. The heat sink has a base thickness of tb = 3 mm and consists of an array of vertical rectangular fins, each of length L = 18 mm. The array has 13 fins, the fin thickness t = 0.2 mm, and pitch S = 2 mm. Air flows with To = 25 C through channels formed between the fins and the cover plate. The convection coefficient h is 150 W/mK. The solder joint offers a thermal resistance of R't,c = 3 106 m K/W. The silicon chip is of a thickness of 5 mm with a conductivity of 14 W/m.K. The chip has a uniform heat generation of 35 W. The chip may be assumed to be isothermal on the finned front surface and adiabatic on the back surface. Determine the maximum temperature of the chip. Assume adiabatic fin tip condition. L +/ S Chip (Tea) Solder (R) Heat sink, k Air (h, T)- Cover plate