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(a) What is the density of the dangling bonds at the surface of a Si wafer with (100) orientation. (b) What do you feel about

(a) What is the density of the dangling bonds at the surface of a Si wafer with (100) orientation.

(b) What do you feel about dangling bonds at the surface of a thin film? Should they be made inactive somehow for device application or should they be left as they
      are?

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