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An artide in Wood Science and Technology. Creep in Chipboard, Part 3: Initial Assessment of the Influence of Moisture Content and Level of Stressing on
An artide in Wood Science and Technology. "Creep in Chipboard, Part 3: Initial Assessment of the Influence of Moisture Content and Level of Stressing on Rate of Creep and Time to Failure" (1981, Vol. 15. pp. 125-144) studied the deflection (mm) of particleboard from stress levels of relative humidity. Assume that the two variables are related according to the simple linear regression model. The data are shown below x = Stress level (%) 54 54 61 61 68 68 75 75 75 y = Deflection (mm) 16.473 18.693 14.305 15.121 13.505 1164 11.168 12.534 11.224 a. Calculate the least square estimates of the intercept (a) and slope (b). What is the estimate of a (c)? b. Find the estimate of the mean deflection if the stress level can be limited to 63% (d). C Estimate the change in the mean deflection associated with a 7% increment in stress level (e). (a) i [Round your answer to 2 decimal places.) (b) i "Round your answer to 3 decimal places.) i "Round your answer to 3 decimal places.) (d) (Round your answer to 2 decimal places.) i [Round your answer to 3 decimal places.) Statistical Tables and Charts
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