business law questions!!

1.P-well doping concentration and depth will affect the?

2.elaborate on the mechanism for the removal of Few parts of photoresist layer

3. In CMOS fabrication, the photoresist layer is exposed to?

4.shed light on the role oflight sensitive polymer in Photoresist layer formation

5.Elaborate on a component that is sputtered on the whole wafer.

6.enumerate the events that lead to the N-wellformation

7.expalin the better forms of CMOS circuits

8.which component is used while carrying out Oxidation process?

9.how is the P-wellinterlinked to n substrate?

10.justify the fact that; In CMOS fabrication, nMOS and pMOS are integrated in same substrate.