Consider a cold plate fabricated from aluminum (k = 190 W/m-K) with regularly spaced rectangular channels through which water is passed. Under normal operation, power dissipation within the chips results in a uniform heat flux of qo = 105 W/m2 at the base of the cold plate while water flows at an average temperature of T = 15oC inside the channels. As shown in Fig. A, using symmetry and assuming that the top surface of the cold plate is well insulated, a corresponding thermal model for the cold plate is illustrated in Fig. C. System reliability considerations dictate that the maximum cold plate temperature must not exceed 40oC. The cooling water is circulated and chemically treated so that fouling factor can be neglected. Fully developed flow may be assumed for approximation. The channel length is 90 mm