Consider a printed circuit board on which 5 identical electronic devices (4 mm 4 mm) are mounted. Air at 27C flows over the device assembly at 10 m/s. The temperature of the printed circuit board and electronic devices is uniform at Ts= 50 everywhere. Air properties at mean film temperature are as follows: k=0.0274W/(mK), =17.610-6 m 2/s, =24.710-6 m 2/s, Pr=0.7 (a) Which device dissipates the most heat through convection? Justify briefly using sketches, diagrams, and/or equations