Consider a thin film of aluminum (Al) that is deposited on a silicon (Si) wafer at 50 C. The elastic modulus of Al is 70 GPa. The linear coefficients of thermal expansion are _Al = 2310^-6 C^-1 for Al and _Si = 310^-6 C^-1 for Si. Assume a yield strength of Al of 85 MPa. (a) Determine the magnitude and sign of the strain in the Al film with respect to the substrate at room temperature (20 C). (b) Determine the equi-biaxial stress in the Al film. (c) Comment on the possible fate of the Al film: will it plastically deform?