Considering that a MEMS chip that contain a thickness-mode piezoelectric resonator whose resonance frequency is defined by the thickness of the piezoelectric plate and the longitudinal acoustic velocity. Determine how much will be improvement in thermal frequency drift if we addtwo trenches to isolate two opposite sides of the piezoelectric MEMS resonator from stresses. Can we improve even further by adding more trenches around the device? Please describe or draw your design