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CS 3375/5303: Computer Architecture Assignment 1 Instructions: Submit your answer in a single doc or, pdf file. Read the questions carefully and answer specifically. You

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CS 3375/5303: Computer Architecture Assignment 1 Instructions: Submit your answer in a single doc or, pdf file. Read the questions carefully and answer specifically. You must include your name and R\# at the top of your submission file. Please refer to the book and lecture notes for the assignments and quizzes. Plagiarism of any kind will not be accepted. Due Date: 02/06/2023 by 11.59 PM. Total Points: 100 Q1. What are the major types of computers? Describe each of the computer types with examples, key features and their use cases. [35) Q2. What is ISA? Describe the 7 dimensions of ISA. (35) Q3. Disk subsystems often have redundant power supplies to improve dependability. MTTF of a single power supply is 500000 hour. Assume one power supply is sufficient to run the disk subsystem and that we are adding one redundant power supply. By adding the second power supply the system becomes 4000 times more reliable. What is the MTTR of the power supply? [15/ Q4. Suppose a wafer can contain multiple number of dies. For a die with 2cm diagonal, the wafer can fit 500 of the dies. What is the wafer area and peripheral? Then, how many dies the same wafer can contain if each die has a side of 4cm ? [15) Q1. What are the major types of computers? Describe each of the computer types with examples, key features and their use cases. (35 Q2. What is ISA? Describe the 7 dimensions of ISA. [35] Q3. Disk subsystems often have redundant power supplies to improve dependability. MTTF of a single power supply is 500000 hour. Assume one power supply is sufficient to run the disk subsystem and that we are adding one redundant power supply. By adding the second power supply the system becomes 4000 times more reliable. What is the MTTR of the power supply? (15) (1) Q4. Suppose a wafer can contain multiple number of dies. For a die with 2cm diagonal, the wafer can fit 500 of the dies. What is the wafer area and peripheral? Then, how many dies the same wafer can contain if each die has a side of 4cm ? [15]

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