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Current technology uses high-resolution X-rays and lasers for inspection of solder-joint defects on printed circuit boards (PCBs). A particular manufacturer of laser-based inspection equipment claims
Current technology uses high-resolution X-rays and lasers for inspection of solder-joint defects on printed circuit boards (PCBs). A particular manufacturer of laser-based inspection equipment claims that its product can inspect on average at least 10 solder joints per second when the joints are spaced 0.1 inch apart. The equipment was tested by a potential buyer on 48 different PCBs. In each case, the equipment was operated for exactly 1 second. The numbers of solder joints inspected on each run are shown in the accompanying data table. Complete parts a through c. Click the icon to view the data a. The potential buyer wants to know whether the sample data refute the manufacturer's claim. Specify the null and alternative hypotheses that the buyer should test. Choose the correct answer below. O A. Ho: H# 10 O B. Ho: H = 10 Ha: H = 10 OL
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