In semiconductor manufacturing, wet chemical etching is often used to remove silicon from the backs of wafers prior to metalization. The etch rate is an important characteristic in this process and known to follow a normal distribution. Two different etching solutions have been compared, using two random samples of 10 wafers for each solution. The observed etch rates are as follows (in mils/min): Solution 1 Solution 2 9.7 10.4 10.1 10.0 9.4 10.3 10.6 10.2 9.3 10.0 10.7 10.7 9.6 10.3 10.4 10.4 10.2 10.1 10.5 10.3 Test the hypothesis Ho: o = 0 against H : 0 using a = 0.05. Round your answer to 3 decimal places (e.g. 98.765). Test statistic: i Conclusion: Ho-