In semiconductor manufacturing. wet chemical etching is often used to remove silicon from the backs of wafers prior to metalization. The etch rate is an important characteristic in this process and known to follow a normal distribution. Two different etching solutions have been compared, using two random samples of 10 wafers for each solution. Assume the variances are equal. The etch rates are as follows (in mils per minute): Solution 1 Solution 2 9.7 10.5 10.6 10.4 9.4 10.3 106 10.2 9.3 10.0 10.7 10.7 9.6 10.3 104 10.4 10.2 10.1 10.5 10.3 (Calculate using the following order. X - X2) -0.848 SHI-H2 S 0.232 ) Round your answers to three decimal places (e.g. 98.765)