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. In the fabrication of semiconductors, one step is the formation of additional gallium arsenide (GaAs) on the surface of a GaAs wafer. To accomplish

. In the fabrication of semiconductors, one step is the formation of additional gallium arsenide (GaAs) on the surface of a GaAs wafer. To accomplish this, gaseous tri- methyl gallium (TMG) and arsine flow in a carrier gas (usually hydrogen) over the solid and react on the solid surface at a temperature of 900K to produce the solid GaAs and gaseous methane. The unreacted TMG and arsine and the newly produced methane flow out in the outlet gas.

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This process can be treated as a steady-state process wherein the deposition of the solid is treated as an outlet stream of pure solid GaAs. For such a process, the following are given:

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where the quantity in the solid out indicates that we wish to deposit 7 mg/min of GaAs. Also, we have assumed that the flow rate of the gas stream doesnt change significantly.

What is the concentration of methane in the outlet gas?

Ga(CH3)3(g)+AsH3(g)GaAs(s)+3CH4(g) TMG Arsine Methane Gas In Gas Out Solid "Out" Stream Flow Rate 8.5L/min8.5L/min7mg/min Components TMG, arsine, TMG, arsine, GaAs H2H2,CH4

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