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Mini-Project 3 Rapid Thermal Processing (RTP) is a particular method to prepare silicon wafers for use in a variety of different electronics applications which
Mini-Project 3 Rapid Thermal Processing (RTP) is a particular method to prepare silicon wafers for use in a variety of different electronics applications which uses radiative heating to rapidly (up to 200 C/s) heat a silicon wafer. In this problem you will analyze a set-up similar to an RTP set-up. The silicon wafer is a very thin circular disk 280 mm in diameter. It is suspended 45 mm away from the heater element in the center of the processing chamber. Both the front and back surfaces of the wafer are exposed and participate in radiative heat transfer and will be treated as separate surfaces, but you may ignore the wafer thickness and the effects of the clamping mechanism used to suspend the wafer. The heater element is also circular but is slightly larger - 295 mm in diameter. The heater element is embedded in one wall of the processing chamber. The processing chamber measures 500 mm x 500 mm x 100 mm. Remember, the heater is embedded in the chamber wall - so do not count the heater area as part of the wall surface area. Heater 500 mm Wafer Enclosure is a rectangular prism with heater embedded in the base. 100 mm 45 mm 500 mm All sides of the processing chamber are stainless steel with emissivity of 0.2 and may be assumed to remain at 310 K throughout processing. The silicon wafer has an emissivity of 0.71 and will initially be at 310 K. The heater element has an emissivity of 0.38 and a surface temperature of 2200 K. For this problem you may assume that absorptivities of all surfaces are equal to their emissivities. Consider all surfaces to be opaque, gray, and diffuse. For the radiation analysis, define the surfaces as follows: Surface 1- The heating element Surface 2 - The face of the wafer that is facing the heating element Surface 3 - The face of the wafer that is facing away from the heating element Surface 4 - All sides of the chamber (remember that the area of the base is the area of the square minus the area of the heater) Part A - View Factors (30 Points) 1. Find all 16 view factors for this problem and list them in the table below. Show your work and clearly indicate which relations you are using/where your equations are coming from. F11= F21 = F31= F41= F12= F22 = F32 = F42= F13 F23= F33= F43= F14= F24= F34 = F44=
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