Problem Definition [Problems 1-7]: The power electronics control module shown below is a high-power device that generates 300 W of heat when operating. This module is fastened to a rigid, flat, metal base plate, which has the highest surface temperature. To ensure the reliability of the electronic components, it is required to cool the base plate in order to maintain its temperature below 80C. However, conduction through the base plate and the natural convection around the unit are inadequate to provide the required heat transfer. The ambient temperature around the module is 45C. It was determined that active cooling is required in order to dissipate the generated heat when the module is operating. Only air is allowed as the working fluid. Base Plate [