Starting with double side polished 500 m thick (100) silicon wafers, outline a fabrication process to produce the dovetail joint-type joints shown in the figures. Specifically, outline a fabrication process to make the top two figures on the left that when assembled together make the structure shown on the right. The tops (wide parts, a and d) of the joints should be 500 m. In addition, specify on the figure all distances a, b, c, d, e, and f. Assume perfect alignment (e.g., between masks, to wafer flat) is possible. How might distances a-f change if alignment is not perfect? a d f