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The following data were collected in an observational study in a semiconductor manufacturing plant. In this plant, the finished semiconductor is wire bonded to a

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The following data were collected in an observational study in a semiconductor manufacturing plant. In this plant, the finished semiconductor is wire bonded to a frame. The reported variable is the pull-strength (a measure of the amount of force required to break the bond). 9.95, 24.45, 31.75, 35.00, 25.02, 16.86, 14.38, 9.60, 24.35, 27.50, 17.08, 37.00, 41.95, 11.66, 21.65, 17.89, 69.00, 10.30, 34.93, 46.59, 44.88, 54.12, 56.63, 22.13, 21.15 a. Construct the relative cumulative frequency distribution table. b. Plot the histogram, polygon, and ogive. c. Calculate the measures of central tendencies. d. Calculate the variance, coefficient of skewness and kurtosis and give its physical meaning. e. Find Q3, D4, and P8

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