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The polymeric, photoresist on a silicon wafer is 540 nm thick and has a density of 0.96 g/cm3. After etching, the photoresist is removed by
The polymeric, photoresist on a silicon wafer is 540 nm thick and has a density of 0.96 g/cm3. After etching, the photoresist is removed by exposure to a solvent that saturates in the polymer at 2.23 mg/cm3. Groups of 20 wafers are done batchwise. If the photoresist completely dissolves in 10 min, what is the mass transfer coefficient for this process?
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