Wafer yield reveals how good you are at making chips.

$-$You are given the radius of a wafer in centimeters. Calculate its area.

$-$Next you are told how often defects occur, expressed as one defect on average per area. If the number is $4\mathrm{.}0,$ then it means that a defect occurs once ever $4$ square centimeters on average. Assume defects are perfectly evenly distributed, not clumped up$.$ That is the value in the $$sq cm per defect$$ column.

$-$Next you are given the size of the die you are trying to manufacture in width and heighth. Calculate the die area.

$-$How many possible dies are there $($whole or part$)$ on this wafer based on the area of the wafer and the die size?

$-$Some of the dies are cut off around the edge of the wafer as we saw in class. The number of those partial dies that you should subtract from the total possible die count is shown as $$Partial Dies Excluded.$$

$-$Calculate the new total, and from those, and the area per defect, calculate the number of dies these defects will spoil. They are your defective dies. Remember, you can$$t have a half of a die that is bad. One defect and it$$s bad.

$-$The remaining dies are good.

$-$From that, calculate your yield, the proportion of good dies of all that could be good.

Given the inputs in the table below, fill in the blanks with the correct values. Remember you can only sell whole, good wafers.

If answers are not integers then provide $2$ decimal points $($e$.$g$.1\mathrm{.}23$ or $12\mathrm{.}30),$otherwise enter integer values.