When an integrated circuit is activated, it dissipates power through uniform volumetric heating. To increase the rate of heat removal from a square-shaped chip, a 4 X 4 array of copper (k = 400 Wm-1K-1) pin fins is attached to the top surface of the chip. The chip is 12.7 mm on a side and the cylindrical pin fins are 1.5 mm in diameter and 1.5 cm in length. The finned surface of the chip is cooled by 20C air with convective heat transfer coefficient of 250 Wm-2K-1, while all other chip surfaces are perfectly insulated. The chip is sufficiently thin to have uniform temperature. a. If the maximum allowable chip operating temperature is 75C, what is the maximum power that can be dissipated by the chip?