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Which of the following problems often encountered when distributing power and ground for a large system on a chip design is helped by adding on-chip
Which of the following problems often encountered when distributing power and ground for a large "system on a chip" design is helped by adding on-chip bypass capacitance between VDD and ground? Select one: a. Ground bounce b. Ohmic (IR) drops c. None of these d. Electromigration e. The need for multiple supply pins
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