Advances in very large scale integration (VLSI) of electronic devices on a chip are often restricted by the ability to cool the chip. For mainframe computers, an array of several hundred chips, each of area 25 mm2, may be mounted on a ceramic substrate. A method of cooling the array is by immersion in a low boiling point fluid such as refrigerant R-134a. At 1 atm and 247 K, properties of the saturated liquid are μ = 1.46 x 10-4 N ∙ s/m2, c p = 1551 J/kg ∙ K. and Pr = 3.2. Assume values of Cs.f = 0.004 and 11 = 1.7.

(a) Estimate the power dissipated by a single chip if it is operating at 50% of the critical heat flux. What is the corresponding value of the chip temperature?

(b) Compute and plot the chip temperature as a function of surface heat flux for 0.25 < q"s/q"max < 0.90.