It is desired to produce a 500 by 500 (m diaphragm, 25 (m thick, in a silicon
Question:
It is desired to produce a 500 by 500 (m diaphragm, 25 (m thick, in a silicon wafer 250 (m thick. Given that you will use a wet etching technique with KOH in water with an etch rate of 1 (m/min, calculate the etching time and the dimensions of the mask opening that you would use on a (100) silicon wafer?
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Calculate the time required for etching as shown below t hr Where t ti...View the full answer
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Related Book For 
Manufacturing Processes for Engineering Materials
ISBN: 978-0132272711
5th edition
Authors: Serope Kalpakjian, Steven Schmid
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