A square (10 mm x 10 mm) silicon chip is insulated on one side and cooled on the opposite side by atmospheric air in parallel flow at U_∞ = 20 m/s and T_∞ = 24°C. When in use, electrical power dissipation within the chip maintains a uniform heat flux at the cooled surface. If the chip temperature may not exceed 80°C at any point on its surface, what is the maximum allowable power? What is the maximum allowable power if the chip is flush mounted in a substrate that provides for an unheated starting length of 20 mm?