Consider the data on wafer contamination and loca- tion in the sputtering tool shown in Table 2-2.

Assume that one wafer is selected at random from this set. Let A denote the event that a wafer contains four or more particles, and let 8 de- note the event that a wafer is from the center of the sputtering tool. Determine:

(a) P(A)

(c) P(B)

(b) P(A|B)

(d) P(BA)

(e) PAB) () P(AUB)