A computer IC chip consumes 10 W of power, which is dissipated as heat. The chip measures 4 cm by 4 cm on a side and is 0.5-cm thick. Currently the IC chip is packaged into an electronic device as shown in Figure 17.5. The base of the chip is in contact with an inert aluminum plate that is 0.3-cm thick. The IC chip and its aluminum base are mounted within a thermally insulating ceramic material, which you may be assumed to act as a perfect thermal insulator. The top side of the IC chip is exposed to air, which provides a convective heat transfer coefficient of 100 W/m²· K. The ambient air temperature (T_ˆž) is maintained at 30°C. The chip is operated for a sufficient time that steady-state operation can be assumed. Within the process temperature range of interest, the thermal conductivity of the IC chip material is k_IC= 1 W/m · K, and the thermal conductivity of aluminum is k_Al= 230 W/m · K.
a. What is the surface temperature, T₁, of the IC chip exposed to the air?
b. What is the temperature, T₂, of the IC chip package at the base of the IC chip (x = L₁) resting on top of the aluminum plate?

Figure 17.5

Transcribed Image Text:

air flow h = 100 W/m2-K T = 30°C -x = 0, T = T, IC Chip, kic = 1.0 W/m-K x = L,=0.5 cm, T=T2 x = L2, T = T3 Aluminum insulated boundary 4.0 cm IC chip imbedded in insulated boundary. Δr