Consider the manufacture of photovoltaic silicon, as described in Problem 1.42. The thin sheet of silicon is
Question:
Consider the manufacture of photovoltaic silicon, as described in Problem 1.42. The thin sheet of silicon is pulled from the pool of molten material very slowly and is subjected to an ambient temperature of T∞= 527°C within the growth chamber. A convection coefficient of h = 7.5 W/m2 · K is associated with the exposed surfaces of the silicon sheet when it is inside the growth chamber. Calculate the maximum allowable velocity of the silicon sheet Vsi. The latent heat of fusion for silicon is hsf = 1.8 106 J/kg. It can be assumed that the thermal energy released due to solidification is removed by conduction along the sheet.
Data From Problem 1.42
One method for growing thin silicon sheets for photovoltaic solar panels is to pass two thin strings of high melting temperature material upward through a bath of molten silicon. The silicon solidifies on the strings near the surface of the molten pool, and the solid silicon sheet is pulled slowly upward out of the pool. The silicon is replenished by supplying the molten pool with solid silicon powder. Consider a silicon sheet that is Wsi = 85 mm wide and tsi = 150 μm thick that is pulled at a velocity of Vsi = 20 mm/min. The silicon is melted by supplying electric power to the cylindrical growth chamber of height H = 350 mm and diameter D = 300 mm. The exposed surfaces of the growth chamber are at Ts = 320 K, the corresponding convection coefficient at the exposed surface is h = 8 W/m2 · K, and the surface is characterized by an emissivity of εs = 0.9. The solid silicon powder is at Tsi,i = 298 K, and the solid silicon sheet exits the chamber at Tsi,o = 420 K. Both the surroundings and ambient temperatures are T∞ = Tsur = 298K.
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Fundamentals Of Heat And Mass Transfer
ISBN: 9780470501979
7th Edition
Authors: Theodore L. Bergman, Adrienne S. Lavine, Frank P. Incropera, David P. DeWitt