Consider the manufacture of photovoltaic silicon, as described in Problem 1.42. The thin sheet of silicon is

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Consider the manufacture of photovoltaic silicon, as described in Problem 1.42. The thin sheet of silicon is pulled from the pool of molten material very slowly and is subjected to an ambient temperature of T= 527°C within the growth chamber. A convection coefficient of h = 7.5 W/m· K is associated with the exposed surfaces of the silicon sheet when it is inside the growth chamber. Calculate the maximum allowable velocity of the silicon sheet Vsi. The latent heat of fusion for silicon is hsf = 1.8 106 J/kg. It can be assumed that the thermal energy released due to solidification is removed by conduction along the sheet.


Data From Problem 1.42

One method for growing thin silicon sheets for photovoltaic  solar panels is to pass two thin strings of high  melting temperature material upward through a bath of  molten silicon. The silicon solidifies on the strings near  the surface of the molten pool, and the solid silicon sheet  is pulled slowly upward out of the pool. The silicon is replenished by supplying the molten pool with solid silicon  powder. Consider a silicon sheet that is Wsi = 85 mm  wide and tsi = 150 μm thick that is pulled at a velocity of  Vsi = 20 mm/min. The silicon is melted by supplying  electric power to the cylindrical growth chamber of  height H = 350 mm and diameter D = 300 mm. The  exposed surfaces of the growth chamber are at T= 320 K, the corresponding convection coefficient at the exposed surface is h = 8 W/m· K, and the surface is characterized by an emissivity of ε= 0.9. The solid silicon powder is at Tsi,i = 298 K, and the solid silicon sheet exits the chamber at Tsi,o = 420 K. Both the surroundings and ambient temperatures are T∞ = Tsur = 298K.

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Fundamentals Of Heat And Mass Transfer

ISBN: 9780470501979

7th Edition

Authors: Theodore L. Bergman, Adrienne S. Lavine, Frank P. Incropera, David P. DeWitt

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