1. Consider a CPU manufacturing process using 300mm wafers.

a. If the dimensions of the die are 1.2cm x 0.8cm, what is the approximate number of dies produced?

b. Assuming a defect density of 0.55/cm, what is the die yield?

c. If the wafer costs $300, what is the price of a die?

d. If the chip price is 22% more than the cost per die, what is the chip price?

2. Assume a 15cm diameter wafer has a cost of $12, contains 84 dies, and has 0.02

defects/cm. Assume a competing 20cm diameter wafer has a cost of $15,contains 100 dies, and has 0.031 defects/cm

a. Find the yield for both wafers.

b. Find the cost per die for both wafers.

c. If the number of dies per wafer is increased by 10% and the defects per area

unit increases by 15%, find the die area and yield in each case.

3. Lets assume an improved fabrication process improves die yield from 0.92 to

0.95. Find the defects per area unit before and after this improvement, using a

die area of 200mm

4. Assume that the die area for a particular chip product increases by 31% as more

software is integrated into the chip. Using the derivation from class, what is the

expected approximate cost of the new chip relative to the original chip?

5. Suppose the cost of a chip relative to the previous version is 3.5 times. If this

was all due to increases in die area, by what factor did the die area increase?