1) Describe an RF sputter system. What is its major limitation? 2) Discuss how a magnetron sputtering system improves the deposition rate. 3) Describe ionized metal plasma or ionized deposition. 4) What is the typical method for creating a tungsten plug in advanced ICs? 5) Explain the fundamental process of copper electroplate. 6) What is the primary reason for implementing the dual-damascene process for copper