2. You are hired by HAL Inc. as an industrial engineer in charge of the large panel line that makes printed circuit boards. The manufacturing processes are as follows. Rate (panel/hour) 211 181 125 Process Time (hour) 3.5 1.3 3.2 ProcessS Description Lamination (Cores) Press copper and prepreg into core blanks Machinin Internal Circuit Optical Test and Repair (Internal) Lamination Composites Trim cores to size Etch circuitry into the copper of cores Scan panels optically for defects Press cores into multiple laver boards Etch circuitry into copper on the outside of 142 197 2.1 External Circuit 151 3.4 composites Optical Test and Repair External Scan composites optically for defects 1.4 Holes to provide connections between layers Deposits copper in holes to establish connections Apply plastic coating to protect boards Cut panels into boards Final electrical test Drilling 166 8.2 Copper Plate Procoat Sizin End of Line Test 131 137 127 163 2.3 4.0 0.9 0.8