2/3. Screen: Quality measured by the height of the material deposited, through a control chart Nominal Control Chart: Xdouble bar Reject Rate 10 mils USL 10.25 12 LSL 8 %, UCLX PPM, Yield 11.25 LCLX % Cp. 9.25 Sample Size Cpk_ 4 Oven Quality measured by #solder shorts in 1000 parts, using C chart, assume process centered and two- sided specification limit Nominal 3 shorts/1000 parts C chart: Cbar Reject Rate %, PPM, Yield % UCLC LCLC Cpk_ Total Process: Quality measured by all defects in the line of two machines, assume process centered and two- sided specification limit Reject Rate %, PPM, Yield % Cp Cpk_