3. Assume a 15 cm diameter wafer has a cost of 12, contains 84 dies, and has 0.020 defects/cm2. Assume a 20 cm diameter wafer has a cost of 15, contains 100 dies, and has 0.031 defects/em? a. Find the yield for both wafers. b. Find the cost per die for both wafers c. If the number of dies per water is increased by 10% and the defects per area unit increases by 15%, find the die area and yield, d. Assume a fabrication process improves the yield from 0.92 to 0.95. Find the defects per area unit for each version of the technology given a die area of 200 mm 4. One pitfall cated in Section 1.10 is expecting to improve the overall performance of a computer by improving only one aspect of the computer. Consider a computer running a program that requires 250s, with 70s spent executing FP instructions, 55s executing INT instructions, 85s executed LIS instructions, and 40s spent executing branch instructions 3. By how much is the total time reduced if the time for FP operations is reduced by 20% b By how much is the time for INT operations reduced if the total time is reduced by 20% a Can the total time can be reduced by 20% by reducing only the time for branch instructions