A carbon/epoxy lamina is clamped between rigid plates in a mold (see figure below) while curing at a temperature of 125C. After curing, the lamina/mold assembly (still clamped together) is cooled from 125C to 25C. The cooling process occurs in moist air and the lamina absorbs 0.5% of its weight in moisture. The lamina has the following properties: Ej = 140 GPa, E2 = 10 GPa, G12 = 7.0 GPa, v12 = 0.3 a1 = -0.3 x 10* /C, az = 28 x 10 C, Bi=0, B2=0.44 Assuming that the lamina properites do not change over this temperature range and that the lamina is initially dry and stress free, determine the residual hygrothermal stresses in the lamina at 25C for angles 0 = 0 and 45. Rigid plate Lamina Rigid plate