A novel scheme for cooling computer chips uses a thermosyphon containing a saturated fluorocarbon. The chip is brazed to the bottom of a cuplike container, within which heat is dissipated by boiling and subsequently transferred to an external coolant (water) via condensation on the inner surface of a thin-walled tube. The nucleate boiling constants and the properties of the fluorocarbon are provided in Problem #1. In addition, k = 0.054 W/mK and the nucleate boiling constants are Cs,f = 0.005 and n=1.7. (a) If the chip operates under steady-state conditions and its surface heat flux is maintained at 90% of the critical heat flux, what is its temperature 7? What is the total power dissipation if the chip width is Le= 20 mm on a side? (b) If the tube diameter is D =30 mm and its surface is maintained at T, = 25C by the water, what tube length L is required to maintain the designated conditions? Water D L Vapor TS g -Saturated fluorocarbon, Tsat Insulation Liquid Computer chip, T Lc