A PCB assembly line consists of $3$ operations: Screen

the boards, Place the components and solder the

components in an oven. Each operation is described

as follows $($Assume that Total Process Average $=$ Total Operation Nominal with a $2-$sided distribution.

Screen: Quality measured by the height of the material deposited, through a control chart

Nominal $,10,$mils, USL$\_12,$No lower limit provided

Control Chart : Xdouble bar : $10\mathrm{.}1,$ UCLX : $11\mathrm{.}1,$ LCLX : $9\mathrm{.}1$ : Sample Size $4$

Reject Rate $\_\_\_\_\_\_\_\_\_\_\_\_\%,\_\_\_\_\_\_\_\_\_$PPM$,$ Yield $\_\_\_\_\_\_\_\_\_\_\_\_\_\%$ Cp $\_\_\_\_\_\_\_\_,$ Cpk$\_\_\_\_\_\_\_\_\_\_\_$

Place: Quality measured by the defect rate obtained, using P chart with sample average $=100,$ assume process centered and two$-$sided specification limit

Reject rate $\_\_1$ in $2,000,\_\_\_\_\%,\_\_\_\_\_$ PPM$,$ Yield $\_\_\_\_\_\_\_\_\_\_\_\_\_\%,$ Cp$\_\_\_\_\_\_\_\_,$ Cpk$\_\_\_\_\_\_\_\_\_\_\_$

Oven Quality measured by # solder shorts in $10,000$ parts, using C chart, assume process centered and two$-$ sided specification limit

Nominal $\_\_\_8$ short$/10,000$ parts, C chart : Cbar$\_\_\_\_\_\_\_,$ UCLc $\_\_\_\_\_\_\_$ LCLc $\_\_\_\_\_\_\_\_\_$

Reject Rate $\_\_\_\_\_\_\_\_\_\_\_\_\%,\_\_\_\_\_\_\_\_\_$PPM$,$ Yield $\_\_\_\_\_\_\_\_\_\_\_\_\_\%,$ Cp $\_\_\_\_\_\_\_\_,$ Cpk$\_\_\_\_\_\_\_\_\_\_\_$

Total Process: Quality measured by all defects in the line of three machines, assume process centered and two sided specification limit

Reject Rate $\_\_\_\_\_\_\_\_\_\_\_\_\%,\_\_\_\_\_\_\_\_\_$PPM$,$ Yield $\_\_\_\_\_\_\_\_\_\_\_\_\_\%$ Cp $\_\_\_\_\_\_\_\_,$ Cpk$\_\_\_\_\_\_\_\_\_\_\_$