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Calculate the maximum dies per wafer, yield, and cost per die for each of the fabrication nodes ( i . e Processor A on Process

Calculate the maximum dies per wafer, yield, and cost per die for each of the fabrication nodes (i.e Processor A on Process Node X, Processor A on Process Node Y, etc.) based on the information provided. You should use a 300mm diameter wafer for all calculations.
Processor A
Size: 9mm x 8mm
Processor B
Sze: 14mm21mm
Process Node X
Cost per wafer: $5,000
Defect Density: 008 defects per mm2
Process Node Y:
Cost per wafer: $10,000
Defect Density: 001 defects per mm2
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