Consider a silicon wafer of 125-mm in diameter inside a cleanroom class 10 that is left exposed to a 30 m/min air flow for 1 minute. How much dust in the form of 0.5 m particles will be deposited on the wafer? And, if the wafer holds 200 printed circuits, what porcentaje of them could be affected by the exposition, supposing 1 particle per each printed circuit?