Current technology uses high-resolution X-rays and lasers for inspection of solder-joint defects on printed circuit boards (PCBS). A particular manufacturer of laser-based inspection equipment claims that product can inspect on average at least 10 solder joints per second when the joints are spaced 0.1 inch apart. The equipment was tested by a potential buyer on 48 different PCBs. In each case, the equipment was operated for exactly 1 second. The numbers of solder joints inspected on each run are shown in the accompanying data table. Complete parts a through c. Click the icon to view the data. Ha: H > 10 Ha : H F 10 O C. Ho: H # 10 D. Ho: H = 10 Ha: H = 10 Ha: H 10 - X O C. Ho: H # 10 Data table Ha: H = 10 b. In the context of this exe 10 9 10 First identify what a Type le 8 10 0 8 00 60 9 Do 00 N O A. A Type I error would 10 12 11 O 11 11 mean is equal to 10. 12 11 B. A Type I error would ean is equal to 10. O C. A Type I error would the mean is equal to 10. O D. A Type I error would an is less than 10. Print Done Now identify what a Type II A. A Type II error would s than 10. O B. A Type ll error would be to conclude that the true mean number of solder joints inspected is not equal to 10 when, in fact, the mean is equal to 10. O C. A Type ll error would be to conclude that the true mean number of solder joints inspected is less than 10 when, in fact, the mean is equal to 10. O D. A Type ll error would be to conclude that the sample mean number of solder joints inspected is 10 when, in fact, the mean is greater than 10. c. Conduct the hypothesis test you described in part a and interpret the test's results in the context of this exercise. Use a = 0.05. Calculate the value of the test statistic. z= (Round to two decimal places as needed.)