Question
During the fabrication of your MOSFET or PMOS this semester, it was discovered that the etch rate of silicon dioxide (SiO2) in BOE had dropped
During the fabrication of your MOSFET or PMOS this semester, it was discovered that the etch rate of silicon dioxide (SiO2) in BOE had dropped from a typical etch rate of 20 /s to 4 /s. Briefly explain the impact that this lower etch rate has on the various oxide etching steps in the fabrication of the MOSFET.
Step by Step Solution
There are 3 Steps involved in it
Step: 1
Get Instant Access to Expert-Tailored Solutions
See step-by-step solutions with expert insights and AI powered tools for academic success
Step: 2
Step: 3
Ace Your Homework with AI
Get the answers you need in no time with our AI-driven, step-by-step assistance
Get Started
Fundamentals of Heat and Mass Transfer
Authors: Incropera, Dewitt, Bergman, Lavine
6th Edition
978-0470055540, 471457280, 470881453, 470055545, 978-0470881453, 978-0471457282
