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Federal Semiconductors issued 8% bonds, dated January 1, with a face amount of $830 million on January 1, 2016. The bonds sold for $753,634,356 and

Federal Semiconductors issued 8% bonds, dated January 1, with a face amount of $830 million on January 1, 2016. The bonds sold for $753,634,356 and mature on December 31, 2035 (20 years). For bonds of similar risk and maturity the market yield was 9%. Interest is paid semiannually on June 30 and December 31.

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