heat transfer. pls provide full ans with legible handwriting. thank you

An array of 10 silicon chips, each of length L=10mm on a side, is insulated on one surface and cooled on the opposite surface by atmospheric air in parallel flow with T=24C and u= 40m/s. When in use, the same electrical power is dissipated in each chip, maintaining a uniform heat flux over the entire cooled surface. If the temperature of each chip may not exceed 80C, what is the maximum allowable power per chip? What is the maximum allowable power if a turbulence promoter is used to trip the boundary layer at the leading edge? Would it be preferable to orient the array normal, instead of parallel, to the airfiow